Author Guidelines & Registration

Author Guidelines for ICAE 2026

9th International Conference on Applied Engineering

Politeknik Negeri Batam (Polibatam)


ICAE 2026 adopts IEEE-standard practices for conference organization, including the use of EDAS for all submissions and a rigorous double-blind peer-review process. The guidelines below ensure fairness, academic integrity, and high-quality proceedings. All accepted papers will be submitted for inclusion in IEEE Xplore® (subject to IEEE quality review) and are also planned for indexing in Scopus and Web of Science.

1. Submission Workflow (Double-Blind Process)

The complete author journey is illustrated in the flowchart below. Key points:

ICAE 2026 Author Workflow
  • Register & Submit via EDAS: https://edas.info/N35485
  • Initial submissions must be fully anonymized (double-blind).
  • Plagiarism check (max 20% similarity) before review.
  • Minimum 2 reviewers; if both recommend rejection (or major conflict), a 3rd reviewer is assigned.
  • Accepted papers Camera-ready (with author details restored) Payment (Non-Polibatam authors) Presentation Publication.

2. Double-Blind Review Policy (IEEE Standard)

All submissions undergo double-blind review — reviewers do not see author identities, and authors do not know reviewer identities.

For Initial Submission (Full Paper)

  • Remove all author names, affiliations, emails, and acknowledgments from the title page and body.
  • Cite your own previous work in the third person (e.g., “Previous work by Smith et al. [X] demonstrated…” instead of “In our previous work [X]…”).
  • Remove funding statements, project names, or any identifying information.
  • Clear document metadata/properties of author details.
  • Do not upload a version that reveals your identity.

After Acceptance

Prepare the camera-ready version with full author names, affiliations, ORCID (recommended), and acknowledgments restored.

No changes to author list or affiliations are allowed after acceptance without written approval from the TPC chairs.

3. Paper Format & Template

  • For full IEEE alignment, we strongly recommend the official IEEE conference template (two-column format) from: IEEE Template Link.
  • Maximum length follows the template (typically 4–6 pages + references; extra pages incur charges — see Pricing section).
  • File format for submission: as specified in the IEEE template (currently .docm macro-enabled; zip if required, or .tex). Final camera-ready must pass quality checks.

4. Plagiarism & Similarity Policy

Maximum acceptable similarity index: 20%

All papers are checked with iThenticate (or equivalent). Self-plagiarism is strictly prohibited.

⚠️ Papers exceeding the threshold or showing significant overlap will be rejected (desk reject or after review).

5. Publication Ethics (COPE Compliant)

This conference follows the Committee on Publication Ethics (COPE) guidelines in all aspects of publication ethics and misconduct handling.

Author Responsibilities:

  • Authors attest that the material has not been previously published and that they have not transferred rights to another party.
  • Authors must ensure originality and properly cite others’ work using IEEE-style references.
  • Authorship must follow COPE criteria.
  • Do not disclose personal/subject-identifying information (photos, pedigrees, etc.) without written consent.
  • Make raw data available upon request if data fabrication/falsification is suspected.
  • Declare all conflicts of interest (employment, funding, consultancies, IP, etc.).

Read more: COPE Guidelines | https://publicationethics.org/resources/guidelines

6. Camera-Ready, Copyright & Final Steps

  1. Address all reviewer comments.
  2. Restore author information and acknowledgments.
  3. Complete the copyright transfer form via EDAS.
  4. Upload the final compliant file to EDAS by the camera-ready deadline.
  5. Payment is required to confirm inclusion in proceedings and secure presentation slot.

7. Presentation & No-Show Policy

All accepted papers must be presented at the conference by at least one registered author or a designated substitute presenter.

🚫 No-show papers (papers whose authors or substitutes fail to present) will NOT be published in the conference proceedings and will not be submitted for indexing.

If an author is unable to attend:

  • Notify the Organizing Committee in advance (minimum 7 days before the conference) via email to [email protected].
  • Arrange for a co-author or colleague to present the paper on their behalf.

Pre-recorded video presentations are only accepted in exceptional cases (e.g., force majeure) and require prior written approval from the Technical Program Committee. The author must still be available for live Q&A during the scheduled session.

This policy ensures fairness to all participants and maintains the academic quality of ICAE 2026.
Call for Papers • ICAE 2026 Politeknik Negeri Batam • Hybrid Conference
"Advancing Human-Machine Synergy through Semiconductor and AI Innovation for Sustainable Development"

Track 2 proceedings are scheduled to be submitted for inclusion into IEEE Xplore® and indexed by Scopus.

Track 1
SINTA-Accredited Journal

Scope: Mechanical, Materials, Manufacturing, and Applied Engineering disciplines outside IEEE scopes.

Track 2
IEEE Proceeding (Scopus / IEEE Xplore)

Scope: Cluster A (Electrical & Electronics), Cluster B (Informatics & AI), Cluster C (Mechatronics).

Submission Format & Template

Please format your manuscript according to the official IEEE Conference Template:

Proceeding Paper Requirements
  • File Format: PDF format only (all other file formats are strictly rejected).
  • Page Limit: Maximum of 6–8 pages including figures, tables, and references.
  • Similarity Index: Must not exceed 20% (double-blind peer review compliance).

ONLINE FULL PAPER SUBMISSION

Submit Paper via EDAS (ICAE 2026)
Direct EDAS Portal: https://edas.info/N35485
Important Dates
Milestone Event Deadline Date
Full Paper Submission Deadline Initial manuscript submission via EDAS 30 September 2026
Notification of Paper Acceptance Double-blind peer-review results 26 October 2026
Final Manuscript & Payment Camera-ready submission & registration 6 November 2026
Conference Dates Hybrid technical & keynote sessions 19 – 20 November 2026
Need Further Assistance?

For inquiries regarding paper submissions, reviews, registration confirmation, or official Letters of Invitation, please contact our secretariat:

[email protected]
Early Bird Registration Closes: 6 November 2026

Registration Fee

Early Bird Deadline: 6 November 2026  •  Regular Deadline: 7–18 November 2026  •  Conference: 19–20 November 2026

Track 2 — IEEE Proceeding (Scopus / IEEE Xplore)

International & Local / Domestic Participants

Participant Categories Early Bird (Until 6 Nov) Regular (7 - 18 Nov)
On Site Virtual On Site Virtual
International
Participant
Non IEEE Member $400.00$400.00 $450.00$450.00
IEEE Member $350.00$350.00 $400.00$400.00
Student Non IEEE Member $350.00$350.00 $400.00$400.00
Student IEEE Member $325.00$325.00 $350.00$350.00
Non Presenter $150.00$150.00 $200.00$200.00
Additional Page $10.00$10.00 $10.00$10.00
Local / Domestic
Participant
Non IEEE Member Rp 3.500.000Rp 3.500.000 Rp 3.750.000Rp 3.750.000
IEEE Member Rp 3.250.000Rp 3.250.000 Rp 3.500.000Rp 3.500.000
Student Non IEEE Member Rp 3.250.000Rp 3.250.000 Rp 3.500.000Rp 3.500.000
Student IEEE Member Rp 3.000.000Rp 3.000.000 Rp 3.250.000Rp 3.250.000
Non Presenter Rp 1.500.000Rp 1.500.000 Rp 1.500.000Rp 1.500.000
Additional Page Rp 100.000Rp 100.000 Rp 100.000Rp 100.000

Applies to accepted papers submitted to IEEE Xplore® Cluster A (Electrical & Electronics), B (Informatics & AI), and C (Electromechanical & Mechatronics).

Track 1 — SINTA Journal Special Section

National / SINTA Publication Fee

Participant Categories Early Bird (Until 6 Nov) Regular (7 - 18 Nov)
On Site Virtual On Site Virtual
Local / Domestic
Participant
Regular Author Rp 1.750.000Rp 1.750.000 Rp 2.000.000Rp 2.000.000
Student Author Rp 1.500.000Rp 1.500.000 Rp 1.750.000Rp 1.750.000

For papers routed to SINTA-accredited partner journals (scopes in Mechanical, Materials, and Applied Engineering outside IEEE field of interest).